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NCP690, NCP691, NCP692 1 A, Low IGND, Very Low Dropout Regulator (VLDO) with/without Enable
The NCP690, NCP691, NCP692 CMOS LDO family provides 1 A of output current with enhanced ESD in either fixed voltage options or an adjustable output voltage from 5.0 V down to 1.25 V. This device is designed for space constrained and portable battery powered applications and offer additional features such as high PSRR, low Quiescent and Ground current consumption, low noise operation, short circuit and thermal protection. The device is designed to be used with low cost ceramic capacitors and is packaged in the 6-Lead DFN3x3 package.
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DFN6 3x3 MN SUFFIX CASE 506AH
1
MARKING DIAGRAM
1 xxxzz AYWW G Pb-Free xxx zz A Y WW G = 690, 691, 692 = 15, 18, 25, 33, 50, AD = Assembly Location = Year = Work Week = Pb-Free Package
* Output Voltage Options: Adjustable, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V * Adjustable Output by External Resistors from 5.0 V down to 1.25 V * Guaranteed 1 A Output Current * 1.5% Output Voltage Tolerance over All Operating Conditions * * * * * * * * * * * * *
- Other Options Possible
(Adjustable) 2% Output Voltage Tolerance over All Operating Conditions (Fixed) Typical Noise Voltage of 50 mVrms without a Bypass Capacitor Typical Dropout Voltage of 190 mV at 1 A (Vout = 2.5 V, TJ = 25C) Active Output Discharge Active Low Enable Pin (NCP691 Device) Active High Enable Pin (NCP692 device) Enhanced ESD: 4 kV and 400 V
PIN ASSIGNMENT
GND GND SNS GND OUT N/C EN ADJ EN OUT IN IN 1 GND SNS IN OUT GND IN 1 GND IN OUT ADJ GND IN IN
1
Applications
Laptops and PCI Cards Modem Banks and Telecom Boards DSP, FPGA, Microprocessor Boards Portable, Battery-Power Applications Hard Disk Drives These are Pb-Free Devices
NCP690 - 6 PIN DFN Fixed Version (Bottom View) GND
NCP691, NCP692 - 6 PIN DFN Fixed Version (Bottom View)
1
NCP690 - 6 PIN DFN Adjustable Version (Bottom View)
N/C
IN
NCP691, NCP692 - 6 PIN DFN Adjustable Version (Bottom View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2009
September, 2009 - Rev. 6
1
Publication Order Number: NCP690/D
NCP690, NCP691, NCP692
VIN 1,6 3 CIN 1 mF** 4 5 COUT 1 mF** VOUT
IN EN*
NCP692 GND
OUT SNS
2, EPAD
Note: * NCP692 device has EN active high Note: ** Minimum value required for stability
Figure 1. NCP692 Typical Application Circuit for Fixed Version
(Output voltage versions: 1.5 V, 1.8 V, 2.5 V, 5.0 V)
VIN
1,6 3
IN EN*
NCP691 GND
OUT SNS
4 5
VOUT
CIN 1 mF**
2, EPAD
COUT 1 mF**
Note: * NCP691 device has EN active low Note: ** Minimum value required for stability
Figure 2. NCP691 Typical Application Circuit for Fixed Version
(Output voltage versions: 1.5 V, 1.8 V, 2.5 V, 5.0 V)
VIN
1,6 3
IN N/C
NCP690 GND
OUT SNS
4 5
VOUT
CIN 1 mF*
2, EPAD
COUT 1 mF*
Note: * Minimum value required for stability
Figure 3. NCP690 Typical Application Circuit for Fixed Version
(Output voltage versions: 1.5 V, 1.8 V, 2.5 V, 5.0 V)
VIN 3.3 V VEN CIN 1 mF**
1,6
5 OUT IN NCP691-ADJ/ NCP692-ADJ 3 4 EN* ADJ GND 2, EPAD
VOUT 2.5 V R1 9.1 k COUT 1 mF**
R2 9.1 k
Note: * NCP691-ADJ device has EN active low and Note: * NCP692-ADJ device has EN active high Note: ** Minimum value required for stability
Figure 4. NCP692 Typical Application Circuit for Adjustable Version
(Adjustable version for 1.25 V < VOUT 5.0 V)
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NCP690, NCP691, NCP692
IN R2 MOSFET DRIVER WITH CURRENT LIMIT THERMAL SHUTDOWN SNS R1 ENABLE LOGIC BANDGAP REFERENCE ACTIVE DISCHARGE OUT
N/C
GND
Figure 5. NCP690 Block Diagram (Fixed Version)
IN R2 MOSFET DRIVER WITH CURRENT LIMIT R1 EN THERMAL SHUTDOWN ENABLE LOGIC BANDGAP REFERENCE ACTIVE DISCHARGE
OUT
SNS
GND
Figure 6. NCP691 Block Diagram (Fixed Version)
IN R2 MOSFET DRIVER WITH CURRENT LIMIT R1 EN THERMAL SHUTDOWN ENABLE LOGIC BANDGAP REFERENCE ACTIVE DISCHARGE SNS OUT
GND
Figure 7. NCP692 Block Diagram (Fixed Version) Table 1. PIN FUNCTION DESCRIPTION FOR FIXED VERSION
Pin No. 1, 6 2 3 4 5 Pin Name IN GND EN OUT SNS Description Voltage inputs which supplies the current to the regulator. Both of these pins should be connected together for full output current capability Power supply ground of the regulator. Connected to the die through the lead frame. Soldered to the copper plane allows for effective heat removal. For NCP691 and NCP692 this pin functions as Enable Active Low and Enable Active High respectively. For NCP690 this pin has no special meaning and should be left disconnected. Regulated output voltage Sense input. This pin should be connected directly to OUT pin.
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NCP690, NCP691, NCP692
IN OUT
MOSFET DRIVER WITH CURRENT LIMIT
ADJ
N/C
THERMAL SHUTDOWN
ENABLE LOGIC
BANDGAP REFERENCE
ACTIVE DISCHARGE
GND
Figure 8. NCP690 Block Diagram (Adjustable Version)
IN
OUT
MOSFET DRIVER WITH CURRENT LIMIT THERMAL SHUTDOWN BANDGAP REFERENCE
ADJ
EN
ENABLE LOGIC
ACTIVE DISCHARGE
GND
Figure 9. NCP691 Block Diagram (Adjustable Version)
IN OUT
MOSFET DRIVER WITH CURRENT LIMIT THERMAL SHUTDOWN BANDGAP REFERENCE
ADJ
EN
ENABLE LOGIC
ACTIVE DISCHARGE
GND
Figure 10. NCP692 Block Diagram (Adjustable Version) Table 2. PIN FUNCTION DESCRIPTION FOR ADJUSTABLE VERSION
Pin No. 1, 6 2 3 4 5 Pin Name IN GND EN ADJ OUT Description Voltage inputs which supplies the current to the regulator. Both of these pins should be connected together for full output current capability Power supply ground of the regulator. Connected to the die through the lead frame. Soldered to the copper plane allows for effective heat removal. For NCP691 and NCP692 this pin functions as Enable Active Low and Enable Active High respectively. For NCP690 this pin has no special meaning and should be left disconnected. Feedback input. Connect to middle point of resistor divider for Adjustable version. Regulated output voltage
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NCP690, NCP691, NCP692
Table 3. ABSOLUTE MAXIMUM RATINGS
Rating Input Voltage (Note 1) Chip Enable Voltage Output Voltage Output Voltage / Sense Input, (SNS pin) Electrostatic Discharge Human Body Model Machine Model Maximum Junction Temperature Storage Temperature Range TJ_MAX TSTG Symbol VIN VEN VOUT VSNS ESD Value -0.3 to 6.5 -0.3 to 6.5 -0.3 to 6.5 -0.3 to 6.5 4000 400 150 -65 to 150 _C _C Unit V V V V V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: This device series contains ESD protection and exceeds the following tests: ESD HBM tested per JEDEC standard: JESD22-A114 ESD MM tested per JEDEC standard: JESD22-A115 Latch-up Current Maximum Rating: 150 mA per JEDEC standard: JESD78
Table 4. PACKAGE THERMAL CHARACTERISTICS
Rating Thermal Resistance, Junction-to-Ambient (Note 2) DFN6 3x3, 1 oz Cu DFN6 3x3, 2 oz Cu Thermal Resistance, Junction-to-Pin Condition 64 Cu 645 mm2 Cu 64 mm2 Cu 645 mm2 Cu mm2 Symbol RqJA RqJA RqJL Value 169 70 151 62 15 Unit C/W C/W C/W
Table 5. OPERATING RANGES
Rating Operating Input Voltage (Notes 3 and 4) Operating Junction Temperature Range Operating Ambient Temperature Range 1. 2. 3. 4. Symbol VIN TJ TA Value 1.5 to 6.0 -40 to 125 -40 to 85 Unit V C C
Minimum VIN = (VOUT + VDO) or 1.5 V, whichever is higher. Soldered on FR4 copper area, please refer to Applications Section for Safe Operating Area. Minimum VIN = (VOUT + VDO) or 1.5 V, whichever is higher. Refer to Electrical Characteristics and Application Information for Safe Operating Area.
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Table 6. ELECTRICAL CHARACTERISTICS VIN = (VOUT + 1 V), VEN = VIN, IOUT = 1 mA, CIN = 10 mF, COUT = 10 mF, for typical
values TJ = 25C, for Min/Max values TJ = -40C to 125C; unless otherwise noted. (Note 5) Parameter Output voltage (Adjustable Version) Output voltage (Fixed Version) Test Conditions VIN = 1.75 V to 6.0 V IOUT = 100 mA to 1 A VIN = (VOUT + 1 V) to 6.0 V IOUT = 100 mA to 1 A VOUT = 1.5 V VOUT = 1.8 V VOUT = 2.5 V VOUT = 3.3 V VOUT = 5.0 V Symbol VOUT VOUT Min 1.231 (-1.5%) 1.470 1.764 2.450 3.234 4.900 (-2%) - - - - - - - Typ 1.250 1.5 1.8 2.5 3.3 5.0 3.2 10 10 10 10 10 450 Max 1.269 (+1.5%) 1.530 1.836 2.550 3.366 5.100 (+2%) 8 30 30 35 35 40 470 Unit V V
Line regulation Load regulation
VIN = (VOUT + 1 V) to 6.0 V IOUT = 100 mA to 1 A VOUT = 1.5 V VOUT = 1.8 V VOUT = 2.5 V VOUT = 3.3 V VOUT = 5.0 V
RegLINE RegLOAD
mV mV
Dropout voltage (Adjustable Version, Note 6) Dropout voltage (Fixed Version, Note 9)
VDO = VIN - VOUT VOUT = 1.25 V IOUT = 1 A IOUT = 1 A VOUT = 1.5 V VOUT = 1.8 V VOUT = 2.5 V VOUT = 3.3 V VOUT = 5.0 V IOUT = 1 A IOUT = 10 mA IOUT = 100 mA IOUT = 1 A IOUT = 10 mA IOUT = 100 mA
VDO
mV
VDO
- - - - - - - - - - -
290 240 190 180 120 145 145 145 145 145 145 0.1 1.6 - - - 0.01
410 380 300 250 210 200 200 200 240 240 240 1 2.4 - - 0.4 250
mV
Ground current
VIN = VOUT + 1 V, VOUT = 1.5 V, 1.8 V, 2.5 V, 3.3 V VIN = VOUT + 1 V, VOUT = 5.0 V
IGND
mA
mA
Disable current (NCP692 only, Notes 5 and 7) Output Current Limit Short Circuit Current Enable High Level Threshold Enable Low Level Threshold (NCP691 and NCP692) Enable Input Current (Enable Active Low) (NCP691 only, Note 8) Enable Input Current (NCP692 only, Note 8) Feedback Current Turn-on Time (Note 8)
VEN < 0.4 V VIN = VOUT + 1 V, VOUT = 85% VOUT_NOM VOUT = 0 V VEN increasing from low to high logic level VEN decreasing from high to low logic level VEN = 0.9 V to VIN
IDIS ILIM ISC VEN_ HI VEN_ LO IEN_HI
- 1.1 1.2 0.9 - -
mA A A V
nA
VEN = 0 V VFB = 1.25 (Adjustable version only) VIN = 0 V to (VOUT +1 V) or 1.75 V VOUT = 0 V to 90% VOUT_NOM
IEN_LO IIFB tON
- - -
0.01 210 50
100 320 -
nA nA ms
5. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 6. Maximum dropout voltage is limited by minimum input voltage. VIN = 1.7 V recommended for guaranteed operation at maximum output current. 7. Refer to the Applications Information Section. 8. Values based on design and/or characterization. 9. Dropout voltage is defined as the differential voltage between VOUT and VIN, when VOUT drops 100 mV below its nominal value.
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NCP690, NCP691, NCP692
Table 6. ELECTRICAL CHARACTERISTICS VIN = (VOUT + 1 V), VEN = VIN, IOUT = 1 mA, CIN = 10 mF, COUT = 10 mF, for typical
values TJ = 25C, for Min/Max values TJ = -40C to 125C; unless otherwise noted. (Note 5) (continued) Parameter Power supply ripple rejection (Note 8) Output noise voltage (Note 8) Thermal Shutdown Temperature (Note 8) Thermal Shutdown Hysteresis (Note 8) Test Conditions VOUT = 1.25 V VIN = VOUT + 1 V, with VPP = 0.5 V, COUT = 1 mF f = 120 Hz f = 1 kHz f = 10 kHz Symbol PSRR Min - - - - - - Typ 62 55 40 50 175 10 Max - - - - - - Unit dB
BW = 200 Hz to 100 kHz, CIN = 1 mF, COUT = 10 mF, TA = 25C
VN TSD TSH
mVrms C C
5. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 6. Maximum dropout voltage is limited by minimum input voltage. VIN = 1.7 V recommended for guaranteed operation at maximum output current. 7. Refer to the Applications Information Section. 8. Values based on design and/or characterization. 9. Dropout voltage is defined as the differential voltage between VOUT and VIN, when VOUT drops 100 mV below its nominal value.
TYPICAL CHARACTERISTICS
1.28 VOUT, OUTPUT VOLTAGE (V) 1.27 1.26 IOUT = 100 mA 1.25 1.24 1.23 1.22 -40 IOUT = 1 A VOUT, OUTPUT VOLTAGE (V) VIN = VOUT_NOM + 1 V = 1.75 V, CIN = COUT = 10 mF 1.55 1.54 1.53 1.52 1.51 1.50 1.49 1.48 1.47 1.46 -40 -15 10 35 60 85 110 135 IOUT = 1 A IOUT = 100 mA VIN = VOUT_NOM + 1 V = 2.5 V, CIN = COUT = 10 mF
-15
10
35
60
85
110
135
TA, AMBIENT TEMPERATURE (C)
TA, AMBIENT TEMPERATURE (C)
Figure 11. Output Voltage vs. Temperature (Vout = 1.25 V)
2.55 VOUT, OUTPUT VOLTAGE (V) VOUT, OUTPUT VOLTAGE (V) 2.54 2.53 2.52 2.51 2.50 2.49 2.48 2.47 2.46 -40 -15 10 35 60 85 110 135 IOUT = 1 A IOUT = 100 mA VIN = VOUT_NOM + 1 V = 3.5 V, CIN = COUT = 10 mF 3.35 3.33 3.31 3.29
Figure 12. Output Voltage vs. Temperature (Vout = 1.5 V)
VIN = VOUT_NOM + 1 V = 4.3 V, CIN = COUT = 10 mF
IOUT = 100 mA
IOUT = 1 A 3.27 3.25 -40
-15
10
35
60
85
110
135
TA, AMBIENT TEMPERATURE (C)
TA, AMBIENT TEMPERATURE (C)
Figure 13. Output Voltage vs. Temperature (Vout = 2.5 V)
Figure 14. Output Voltage vs. Temperature (Vout = 3.3 V)
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TYPICAL CHARACTERISTICS
5.05 VDO, DROPOUT VOLTAGE (mV) VOUT, OUTPUT VOLTAGE (V) 5.04 5.03 5.02 5.01 5.00 4.99 4.98 4.97 4.96 -40 -15 10 35 60 85 110 135 IOUT = 1 A IOUT = 100 mA VIN = VOUT_NOM + 1 V = 6.0 V, CIN = COUT = 10 mF 500 450 400 350 300 250 200 150 100 -40 -15 10 35 60 85 IOUT = 1.0 A, CIN = COUT = 10 mF VOUT = 1.25 V VOUT = 1.5 V VOUT = 1.8 V VOUT = 2.5 V VOUT = 3.3 V VOUT = 5.0 V 110 135
TA, AMBIENT TEMPERATURE (C)
TA, AMBIENT TEMPERATURE (C)
Figure 15. Output Voltage vs. Temperature (Vout = 5.0 V)
270 IGND, GROUND CURRENT (mA) IGND, GROUND CURRENT (mA) 240 210 3.3 V 180 150 120 90 -40 2.5 V 1.5 V 1.25 V -15 10 35 60 85 110 135 TA, AMBIENT TEMPERATURE (C) IOUT = 1.0 A, VIN = VOUT + 1 V VOUT = 5.0 V 270 240 210 180 150 120 90 60 -40
Figure 16. Dropout Voltage vs. Temperature (Vout = 1.25 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V)
VOUT = 5.0 V
IOUT = 100 mA, VIN = VOUT + 1 V
3.3 V
2.5 V 1.5 V 1.25 V
-15
10
35
60
85
110
135
TA, AMBIENT TEMPERATURE (C)
Figure 17. Ground Current vs. Temperature (Vout = 1.25 V, 1.5 V, 2.5 V, 3.3 V, 5.0 V)
1.4 VN, NOISE DENSITY (mVrms/rtHz) 1.2 1.0 0.8 0.6 0.4 0.2 0 10 100 1000 FREQUENCY (Hz) 10,000 VN = 19 mVRMS VN, NOISE DENSITY (mVrms/rtHz) VIN = 2.5 V, VOUT = 1.5 V, CIN = COUT = 1 mF, IOUT = 10 mA, TA = 25C 3.0 2.5
Figure 18. Ground Current vs. Temperature (Vout = 1.25 V, 1.5 V, 2.5 V, 3.3 V, 5.0 V)
VIN = 3.5 V, VOUT = 2.5 V, CIN = COUT = 1 mF, IOUT = 10 mA, TA = 25C
VN = 35 mVRMS 2.0 1.5 1.0 0.5 0
100,000
10
100
1000 FREQUENCY (Hz)
10,000
100,000
Figure 19. Noise Density vs. Frequency (Vout = 1.5 V)
Figure 20. Noise Density vs. Frequency (Vout = 2.5 V)
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NCP690, NCP691, NCP692
TYPICAL CHARACTERISTICS
3.5 VN, NOISE DENSITY (mVrms/rtHz) VOUT, OUTPUT VOLTAGE (V) 3.0 2.5 2.0 1.5 1.0 0.5 0 10 100 1000 FREQUENCY (Hz) 10,000 VN = 64 mVRMS VIN = 6.0 V, VOUT = 5.0 V, CIN = COUT = 1 mF, IOUT = 10 mA, TA = 25C 1.75 1.50 1.25 IOUT VIN = 3.5 V, CIN = COUT = 10 mF, DIOUT/Dt = 0.5 A/1 ms VOUT IOUT, OUTPUT CURRENT (A)
1.0 0.5 0
100,000 TIME (100 ms/DIV)
Figure 21. Noise Density vs. Frequency (Vout = 5.0 V)
Figure 22. Load Transient (Vout = 1.5 V)
VIN = 6.0 V, CIN = COUT = 10 mF, DIOUT/Dt = 0.5 A/1 ms VOUT IOUT
VOUT, OUTPUT VOLTAGE (V)
VOUT, OUTPUT VOLTAGE (V)
2.7 2.5 2.3
VIN = 3.5 V, CIN = COUT = 10 mF, DIOUT/Dt = 0.5 A/1 ms VOUT
5.25 5.00 4.75
IOUT, OUTPUT CURRENT (A)
IOUT, OUTPUT CURRENT (A)
1.0 0.5 0
IOUT
1.0 0.5 0
TIME (50 ms/DIV)
TIME (50 ms/DIV)
Figure 23. Load Transient (Vout = 2.5 V)
CIN = COUT = 10 mF, trise = 10 ms VIN 3
Figure 24. Load Transient (Vout = 5.0 V)
VOUT, OUTPUT VOLTAGE (V)
4
VOUT, OUTPUT VOLTAGE (V)
5 VIN, INPUT VOLTAGE (V) VIN 4
VIN, INPUT VOLTAGE (V)
2.55 VOUT 2.50 2.45 CIN = COUT = 10 mF, trise = 10 ms
1.55 1.50 1.45
VOUT
TIME (50 ms/DIV)
TIME (50 ms/DIV)
Figure 25. Line Transient (Vout = 1.5 V)
Figure 26. Line Transient (Vout = 2.5 V)
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TYPICAL CHARACTERISTICS
VEN
VOUT, OUTPUT VOLTAGE (V)
VEN, VOUT VOLTAGE (V)
VIN
6 VIN, INPUT VOLTAGE (V) 5
2.5 2.0 1.5 1.0 0.5 0
VOUT
5.05 VOUT 5.00 4.95 CIN = COUT = 10 mF, trise = 10 ms
VIN = 2.5 V, CIN = COUT = 10 mF, IOUT = 1 A, trise_EN = 10 ms
TIME (50 ms/DIV)
TIME (50 ms/DIV)
Figure 27. Line Transient (Vout = 5.0 V)
VEN VEN, VOUT VOLTAGE (V)
Figure 28. Start-Up Transient (Vout = 1.5 V)
VEN
3.5 VEN, VOUT VOLTAGE (V) 3.0 2.5 2.0 1.5 1.0 0.5 0
6 5 4 3 2 1 0
VOUT
VOUT
VIN = 3.5 V, CIN = COUT = 10 mF, IOUT = 1 A, trise_EN = 10 ms
VIN = 6.0 V, CIN = COUT = 10 mF, IOUT = 1 A, trise_EN = 10 ms
TIME (50 ms/DIV)
TIME (50 ms/DIV)
Figure 29. Start-Up Transient (Vout = 2.5 V)
70 60 50 PSRR (dB) 40 30 20 10 0 10 100 1000 FREQUENCY (Hz) 10,000 VIN = 2.5 V, VOUT = 1.5 V, VPP = 0.5 V, COUT = 1 mF
Figure 30. Start-Up Transient (Vout = 5.0 V)
100,000
Figure 31. PSRR vs. Frequency (Vout = 1.5 V)
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DEFINITIONS
Load Regulation Line Regulation
The change in output voltage for a change in output load current at a constant temperature.
Dropout Voltage
The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured, when the output drops 100 mV below its nominal value. The junction temperature, load current, and minimum input supply requirements affect the dropout level.
Output Noise Voltage
The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average junction temperature is not significantly affected.
Line Transient Response
Typical output voltage overshoot and undershoot response when the input voltage is excited with a given slope.
Load Transient Response
This is the integrated value of the output noise over a specified frequency range. Input voltage and output load current are kept constant during the measurement. Results are expressed in mVrms or nV Hz.
Ground Current
Typical output voltage overshoot and undershoot response when the output current is excited with a given slope between no-load and full-load conditions.
Thermal Protection
Ground Current is the current that flows through the ground pin when the regulator operates without a load on its output (IGND). This consists of internal IC operation, bias, etc. It is actually the difference between the input current (measured through the LDO input pin) and the output load current. If the regulator has an input pin that reduces its internal bias and shuts off the output (enable/disable function), this term is called the disable current (IDIS.)
Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 175C, the regulator turns off. This feature is provided to prevent failures from accidental overheating.
Maximum Package Power Dissipation
The power dissipation level at which the junction temperature reaches its maximum operating value.
APPLICATIONS INFORMATION The NCP690 regulator is self-protected with internal thermal shutdown and internal current limit. Typical application circuit is shown in Figure 1. A ceramic 10 mF capacitor is recommended and should be connected close to the NCP690 package. Higher capacitance and lower ESR will improve the overall line transient response.
Output Decoupling (COUT) Input Decoupling (CIN)
approximately 20 mV, this circuit becomes active and clamps the output from further voltage increase. Tying the ENABLE pin to VIN will ensure that the part is active whenever the supply voltage is present,
Noise Decoupling
The NCP690 does not require a minimum Equivalent Series Resistance (ESR) for the output capacitor. The minimum output decoupling capacitor required for stability is 1 mF. In order to improve the load transient response and start up performance 10 mF capacitor is recommended. The regulator is stable with ceramic chip as well as tantalum capacitors. Larger values improve noise rejection and load transient response. The required minimum 100 mA load current is assured by the internal resistor divider network. The NCP690 contain an overshoot clamp circuit to improve transient response during a load current step release. When output voltage exceeds the nominal by
The NCP690 is a low noise regulator and needs no external noise reduction capacitor. Unlike other low noise regulators which require an external capacitor and have slow startup times, the NCP690 operates without a noise reduction capacitor, has a typical 50 ms turn-on time and achieves a 50 mVrms overall noise level between 10 Hz and 100 kHz.
Enable Operation
No-Load Regulation Considerations
The enable pin will turn the regulator on or off. The threshold limits are covered in the electrical characteristics table in this data sheet. The turn-on/turn-off transient voltage being supplied to the enable pin should exceed a slew rate of 10 mV/ms to ensure correct operation. If the enable function is not to be used then the pin should be connected to VIN.
Adjustable Operation
The output voltage can be adjusted from 1 to 4 times the typical 1.250 V regulation voltage by the use of resistor
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divider network as shown on Figure 4. The output voltage and resistors should be chosen using Equations 1 and 2.
V OUT + 1.250 1 ) R2 ^ R1 VOUT *1 1.25 1 R1 ) (I ADJ @ R 1) R2
(eq. 1)
The power dissipated by the NCP690 can be calculated from the following equations:
P D [ V IN(I GND@I OUT) ) I OUT(V IN * V OUT)
(eq. 4)
or
(eq. 2)
V IN(MAX) [
250 200 RqJA (C/W) 150 100
P D(MAX) ) (V OUT I OUT ) I GND
I OUT)
(eq. 5)
Input bias current IADJ is typically less than 210 nA. Choose R1 arbitrarily to minimize errors due to the bias current and to minimize noise contribution to the output voltage. Use Equation 2 to find the required value for R2.
Thermal Characteristics
As power dissipated in the NCP690 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When the NCP690 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power applications. The maximum dissipation the NCP690 can handle is given by:
P D(MAX) + [T J(MAX) * T A] R qJA
(eq. 3)
FR4 - 1.0 oz
FR4 - 2.0 oz 50 0
0
200 400 COPPER AREA (mm2)
600
800
Figure 32. Thermal Resistance vs. Copper Area Hints
Since TJ is not recommended to exceed 125C (TJ(MAX)), then the NCP690 can dissipate up to 1 W when the ambient temperature (TA) is 25C.
VIN and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the NCP690, and make traces as short as possible.
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NCP690, NCP691, NCP692
DEVICE ORDERING INFORMATION
Device NCP690MN15T2G NCP690MN18T2G NCP690MN25T2G NCP690MN33T2G NCP690MN50T2G NCP690MNADJT2G NCP691MN15T2G NCP691MN18T2G NCP691MN25T2G NCP691MN33T2G NCP691MN50T2G NCP691MNADJT2G NCP692MN15T2G NCP692MN18T2G NCP692MN25T2G NCP692MN33T2G NCP692MN50T2G NCP692MNADJT2G Nominal Output Voltage 1.5 V 1.8 V 2.5 V 3.3 V 5.0 V ADJ 1.5 V 1.8 V 2.5 V 3.3 V 5.0 V ADJ 1.5 V 1.8 V 2.5 V 3.3 V 5.0 V ADJ Marking 69015 69018 69025 69033 69050 690AD 69115 69118 69125 69133 69150 691AD 69215 69218 69225 69233 69250 692AD Package DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) Shipping 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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13
NCP690, NCP691, NCP692
PACKAGE DIMENSIONS
DFN6 3*3 MM, 0.95 PITCH CASE 506AH-01 ISSUE O
B
D
A
PIN 1 REFERENCE
NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMESNION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MILLIMETERS MIN NOM MAX 0.80 0.90 1.00 0.00 0.03 0.05 0.20 REF 0.35 0.40 0.45 3.00 BSC 2.40 2.50 2.60 3.00 BSC 1.50 1.60 1.70 0.95 BSC 0.21 --- --- 0.30 0.40 0.50
E
DIM A A1 A3 b D D2 E E2 e K L
2X
0.15 C
2X
0.15 C 0.10 C
6X
0.08 C SIDE VIEW
6X
L
1
6X
K
6 4
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
CCC CCC CCC
D2
TOP VIEW
A (A3) A1 e
3 4X
C
SEATING PLANE
SOLDERING FOOTPRINT*
0.450 0.0177 0.950 0.0374
E2
6X
b
(NOTE 3)
3.31 0.130
1.700 0.685
0.10 C A B BOTTOM VIEW 0.05 C 0.63 0.025 2.60 0.1023
SCALE 10:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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14
NCP690/D

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